Ngoku abasebenzisi abaninzi nangakumbi baqonda iintlobo zethagethi kunyeizicelo zayo,kodwa ukwahlulwa kwayo kunokungacaci kakuhle.Ngoku makheInjineli ye-RSM ukwabelana naweuqhelaniso oluthile yemagnetron sputtering targets.
Ithagethi yokutshiza: ithagethi yokugalela intsimbi, ithagethi yokugalela ingxubevange, ithagethi yokwaleka i-ceramic, ithagethi yethagethi ye-ceramic sputtering, ithagethi yethagethi ye-ceramic sputtering. target, sulfide ceramic sputtering target, telluride ceramic sputtering target, ezinye iithagethi zeceramic, Chromium doped silicon oxide ceramic target (CR SiO), indium phosphide target (INP), lead arsenide target (pbas), indium arsenide target (InAs).
I-Magnetron sputtering yohlulwe ngokubanzi ibe ziindidi ezimbini: i-DC sputtering kunye ne-RF sputtering.Umgaqo-nkqubo we-DC sputtering wezixhobo zilula, kwaye izinga layo likwakhawuleza xa kutshiza isinyithi.I-RF sputtering isetyenziswa ngokubanzi.Ukongeza kwi-sputtering data conductive, inokuphinda ikhuphe idatha engasebenziyo.Ithagethi ye-sputtering ingasetyenziselwa ukutshiza okusebenzayo ukulungiselela idatha ehlanganisiweyo efana neeoksidi, ii-nitrides kunye ne-carbides.Ukuba iRF frequency iyanda, iya kuba yi microwave plasma sputtering.Okwangoku, i-electron cyclotron resonance (ECR) i-microwave plasma sputtering iqhele ukusetyenziswa.
Ixesha lokuposa: May-26-2022