Malunga nesicelo kunye nomgaqo wokutshiza itekhnoloji ekujoliswe kuyo, abanye abathengi baye babonisana ne-RSM, ngoku ngenxa yale ngxaki exhalabele ngakumbi, iingcali zobugcisa zabelana ngolwazi oluthile oluhambelanayo.
Sputtering target application:
Amasuntswana atshajayo (afana ne-argon ion) abhobhoza umphezulu oqinileyo, obangela ukuba amasuntswana angaphezulu, afana ne-athomu, iimolekyuli okanye iinyanda zibaleke kumphezulu wento ebizwa ngokuba “yi-sputtering”.Kwi-magnetron sputtering coating, ii-ion ezilungileyo eziveliswa yi-argon ionization zidla ngokusetyenziselwa ukubhobhoza into eqinileyo (ithagethi), kwaye ii-athomu ezithathiweyo ezingathathi hlangothi zifakwe kwi-substrate (workpiece) ukwenza umaleko wefilimu.I-Magnetron sputtering coating ineempawu ezimbini: "ubushushu obuphantsi" kunye "nokukhawuleza".
Umgaqo-siseko wokutshiza weMagnetron:
Intsimi yemagnethi ye-orthogonal kunye nentsimi yombane yongezwa phakathi kwepali ekujoliswe kuyo (i-cathode) kunye ne-anode, kunye negesi ye-inert efunekayo (ngokuqhelekileyo i-Ar gas) izaliswe kwigumbi eliphezulu le-vacuum.Umazibuthe osisigxina wenza i-250-350 Gauss intsimi kazibuthe kumphezulu wezinto ekujoliswe kuzo, kwaye yenza intsimi ye-orthogonal electromagnetic kunye nommandla wombane ophezulu wombane.
Ngaphantsi kwesenzo sommandla wombane, i-Ar gas i-ionized ibe yi-ioni kunye nee-electron, kwaye kukho uxinzelelo oluthile olubi oluphezulu kwithagethi, ngoko ke ii-electron ezikhutshwa kwipali ekujoliswe kuyo ziyachatshazelwa ngumhlaba wemagnethi kunye namathuba e-ionization yokusebenza. ukwanda kwegesi.I-plasma yoxinaniso oluphezulu lwenziwa kufuphi ne-cathode, kwaye i-Ar ions ikhawuleza ukuya kwindawo ekujoliswe kuyo phantsi kwesenzo samandla kaLorentz kwaye ibhobhoze indawo ekujoliswe kuyo ngesantya esiphezulu, ukwenzela ukuba ii-athomu ezitshisiweyo zibaleke kwindawo ekujoliswe kuyo ngokuphezulu. amandla e-kinetic kunye nokubhabha kwi-substrate ukwenza ifilimu ngokomgaqo wokuguqulwa kwesantya.
I-Magnetron sputtering yohlulwe ngokubanzi ibe ziindidi ezimbini: i-DC sputtering kunye ne-RF sputtering.Umgaqo-nkqubo we-DC sputtering wezixhobo zilula, kwaye isantya sikhawuleza xa sitshiza isinyithi.Ukusetyenziswa kwe-RF sputtering kubanzi ngakumbi, ukongeza kwizixhobo eziqhubayo zokutshiza, kodwa kunye nokutshiza izixhobo ezingaqhubekiyo, kodwa kunye nokulungiswa kokutshiza okusebenzayo kweeoksidi, ii-nitrides kunye ne-carbides kunye nezinye izinto ezihlanganisiweyo.Ukuba ubuninzi be-RF buyanda, iba yi-microwave plasma sputtering.Okwangoku, i-electron cyclotron resonance (ECR) uhlobo lwe-microwave plasma sputtering luqhele ukusetyenziswa.
Ixesha lokuposa: Aug-01-2022