Ithagethi ye-sputtering yinto yombane eyenza ifilimu encinci ngokufaka into efana ne-alloy okanye i-oxide yensimbi kwi-substrate ye-elektroniki kwinqanaba le-athomu.Phakathi kwabo, i-sputtering target yefilimu emnyama isetyenziselwa ukwenza ifilimu kwi-EL ye-organic okanye ipaneli ye-crystal ye-liquid ukwenza i-wiring ibe mnyama kunye nokunciphisa ukukhanya okubonakalayo okubonakalayo (i-low reflectance) ye-TFT wiring.Ithagethi ye-sputter ineenzuzo ezilandelayo kunye neziphumo.Xa kuthelekiswa neemveliso zangaphambili, kunceda ekuphuculeni umgangatho ophezulu wokulunga kunye noyilo lwenkululeko yemiboniso eyahlukeneyo, kunye nokunciphisa ingxolo ebangelwa yi-wiring ebonakaliswe ukukhanya kweemveliso ezinxulumene ne-semiconductor.
Izinto ezilungileyo kunye neziphumo zethagethi ye-aluminium:
(1) Emva kokuba injongo ye-aluminium yenziwe kwi-wiring, ukukhanya okubonakalayo kunokunciphisa
xa kuthelekiswa neemveliso zangaphambili, inokufezekisa ukubonakaliswa okuphantsi.
(2) I-DC sputtering inokwenziwa ngaphandle kwegesi esebenzayo
xa kuthelekiswa neemveliso zangaphambili, kuyanceda ukuqonda ifilimu ye-homogeneity yee-substrates ezinkulu.
(3) Emva kokuba ifilimu yenziwe, inkqubo ye-etching inokwenziwa kunye ne-wiring
lungisa izinto ngokwenkqubo ekhoyo yomthengi, kwaye inokudibanisa kunye ne-wiring ngaphandle kokutshintsha inkqubo ekhoyo.Ukongeza, inkampani iya kubonelela ngenkxaso ngokwemiqathango yesputtering yabathengi.
(4) Ukumelana nobushushu obugqwesileyo, ukuxhathisa kwamanzi kunye ne-alkali
ukongeza ukuchasana kwamanzi kunye nokuchasana kwe-alkali, kukwanokumelana nobushushu obuphezulu, ngoko ke iimpawu zefilimu aziyi kutshintsha kwinkqubo yokucubungula i-TFT wiring.
Ixesha lokuposa: Aug-10-2022